That would be in the component drawing from the vendor. -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez Sent: Monday, November 09, 2015 12:51 PM To: [log in to unmask] Subject: [TN] IPC SMT Lead to package co-planarity Fellow TechNetters: In which IPC STD will I find information of distance between the plastic housing standoff and lead height. INMHO the standoff should rest on the solder mask surface while the lead should have a slight gap to rest on the PWB copper pads. I hope that this makes sense. A print/spec is not readily available. Victor, ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________