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September 2015

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Subject:
From:
Vladimir Igoshev <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Thu, 24 Sep 2015 07:17:39 -0400
Content-Type:
text/plain
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Nope

Vladimir

Sent from my BlackBerry 10 smartphone on the Rogers network.
  Original Message  
From: Deng RongJun
Sent: Thursday, September 24, 2015 03:41
To: [log in to unmask]
Reply To: TechNet E-Mail Forum
Subject: [TN] Component solder reliability

Hi Experts:



Is there have an industry standard for component pull/push test? What is standard value for each component?





RongJun Deng

Electronics Engineer

Design Link

BB Electronics (Suzhou) Co., Ltd., EMS - from idea to solution



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