Yes it is, BUT it has nothing to do with reliability, or should I say it's ability to withstand crack formation and propagation‎.

Regards,

Vladimir

SENTEC

Sent from my BlackBerry 10 smartphone on the Rogers network.
  Original Message  
From: Deng RongJun
Sent: Thursday, September 24, 2015 21:30
To: [log in to unmask]
Reply To: TechNet E-Mail Forum
Subject: Re: [TN] Component solder reliability

Hi Bev:

As I know the solder joint strength directly proportional to pad size, is that not correct?



RongJun Deng
Electronics Engineer
Design Link

From: Bev Christian [mailto:[log in to unmask]] 
Sent: Friday, September 25, 2015 8:49 AM
To: 'TechNet E-Mail Forum' <[log in to unmask]>; Deng RongJun <[log in to unmask]>
Subject: RE: [TN] Component solder reliability

Rongjun,
If Werner Engelmaier were still alive he would shake his finger at you! :)

Solder joint strength is not necessarily a sign of a reliable joint. It might or might not mean that a joint is well made but not say much about reliability. For instance Ericsson (I believe) found that small (lower shear strength) solder joints for chip components were actually better because they were more ductile.

That is why you will never find an official published list of pass/fail solder joint strengths.

Bev
Blackberry

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Deng RongJun
Sent: September 24, 2015 3:31 AM
To: [log in to unmask]
Subject: [TN] Component solder reliability

Hi Experts:



Is there have an industry standard for component pull/push test? What is standard value for each component?





RongJun Deng

Electronics Engineer

Design Link

BB Electronics (Suzhou) Co., Ltd., EMS - from idea to solution



Block E, No.58 Yangdong Road, Loufeng, Suzhou Industrial Park- 215122 Suzhou - P.R.China

Office: +86 512 6956 2880 - Direct: +86 512 6956 0125 - Fax: +86 512 6715 7266



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