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Date: | Wed, 16 Sep 2015 09:12:22 -0400 |
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The "magic" Number should stay the same 1-3 micron but you'd also have to keep an eye on what happened to the layer of E-Ni underneath.
Regards,
Vladimir
SENTEC
Sent from my BlackBerry 10 smartphone on the Rogers network.
Original Message
From: Datacom - Juliano Ribeiro
Sent: Wednesday, September 16, 2015 09:09
To: [log in to unmask]
Reply To: TechNet E-Mail Forum
Subject: [TN] BGA Reworked Intermetalic
Hi to all,
When we reworked the BGA, removed the component of the board and replacement
another BGA, what’s the intermetalic thickness ideal after the rework?
p.s: Our pcb is ENIG finished and the solder is Tin Lead.
_____________________________
Juliano Bettim Ribeiro
DATACOM
ENGENHARIA DE PROCESSOS
Rua América Nº 1000 - Eldorado do Sul - RS CEP: 92990-000
+55 (51) 8446-2135
+55 (51) 3933-3000
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