The "magic" Number should stay the same 1-3 micron but you'd also have to keep an eye on what happened to the layer of E-Ni underneath.

Regards,

Vladimir

SENTEC

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  Original Message  
From: Datacom - Juliano Ribeiro
Sent: Wednesday, September 16, 2015 09:09
To: [log in to unmask]
Reply To: TechNet E-Mail Forum
Subject: [TN] BGA Reworked Intermetalic

Hi to all,



When we reworked the BGA, removed the component of the board and replacement
another BGA, what’s the intermetalic thickness ideal after the rework?



p.s: Our pcb is ENIG finished and the solder is Tin Lead.



_____________________________

Juliano Bettim Ribeiro

DATACOM 

ENGENHARIA DE PROCESSOS 
Rua América Nº 1000 - Eldorado do Sul - RS CEP: 92990-000 
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+55 (51) 3933-3000 

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