The "magic" Number should stay the same 1-3 micron but you'd also have to keep an eye on what happened to the layer of E-Ni underneath. Regards, Vladimir SENTEC Sent from my BlackBerry 10 smartphone on the Rogers network. Original Message From: Datacom - Juliano Ribeiro Sent: Wednesday, September 16, 2015 09:09 To: [log in to unmask] Reply To: TechNet E-Mail Forum Subject: [TN] BGA Reworked Intermetalic Hi to all, When we reworked the BGA, removed the component of the board and replacement another BGA, what’s the intermetalic thickness ideal after the rework? p.s: Our pcb is ENIG finished and the solder is Tin Lead. _____________________________ Juliano Bettim Ribeiro DATACOM ENGENHARIA DE PROCESSOS Rua América Nº 1000 - Eldorado do Sul - RS CEP: 92990-000 +55 (51) 8446-2135 +55 (51) 3933-3000 Ramal: 3484 <mailto:[log in to unmask]> [log in to unmask] <http://www.datacom.ind.br/> www.datacom.ind.br ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________