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August 2015

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From:
Ioan Tempea <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ioan Tempea <[log in to unmask]>
Date:
Thu, 27 Aug 2015 15:37:44 +0000
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Hi Adrian,

As IPC-610 states in the first paragraphs, the assembly drawing takes precedence over the standard. In your case, this means that if no criteria exists in IPC-610, you can make your own, based on the end use of the product. Commercial and indoors telecom are pretty lenient, so a quick assessment of the usage (e.g. is there any force going to be applied at some moment) could give you an idea of how strong the joint needs to be. If you're talking hi-rel, a qualification based on reliability testing is necessary.

Once you've made your own criterion, make sure it ends up on the assembly drawing or any other assembly specifications.

Best regards,

Ioan Tempea, P. Eng.
Manufacturing Engineer, Satellite Systems 

MacDonald, Dettwiler and Associates Corporation, 21025 Trans-Canada Highway, Ste-Anne-de-Bellevue, QC, Canada H9X 3R2
Tel: +1-514-457-2150 x3556
www.mdacorporation.com

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-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Adrian Dimulescu
Sent: August-27-15 9:27 AM
To: [log in to unmask]
Subject: [TN] Assembly Method - IPC Class 2 or 3?

We are looking at different methods of attaching a pin to a PCB assembly but are not sure if it's Class 2 or 3 acceptable.  Per attached picture, we want to solder a pin into a plated edge-wrapped slot located at the edge of the board.

Does anybody know if this is acceptable per IPC requirements?  I searched IPC-610 but couldn't find anything similar to this. 

Adrian Dimulescu
MtronPTI
[log in to unmask]
(407) 298-2000 x2263


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