http://www.ti.com/lit/wp/sszy003/sszy003.pdf
fyi.
> agree with Mike.  two typical application: high density multi-level wire
> bonds for stack die (memory or something like piggy backed dram on
> processor - need high speed, high density access).  or high power
> application, thick gold wire bond just too pricy.  Thick copper wire bonds
> is easy, but not HDI type...
> FA is need some new tools: you can't use chemical decapsulation, it eats
> copper no time.  you will need some laser decap equipment.  if you just
> want to get into the game, there is not so low barrier for entry.  prepare
> for 3 month at least for learning curve for HDI, thick wire or ribbon, not
> much or problem, you just need to get hang of it.
> my 1.6 cents.
>                 jk
>> As I understand it, copper is replacing gold especially at small
>> diameters
>> and has pretty well displaced aluminium at large diameters/ribbons in
>> power
>> devices (eg IGBT)where its properties are very advantageous. Bonding is
>> done
>> under local inert or forming gas environment.
>> --
>> Regards
>>
>> Mike Fenner
>> Bonding Services & Products
>> M: +44 [0] 7810 526 317
>> T: +44 [0] 1865 522 663
>>
>> -----Original Message-----
>> From: TechNet [mailto:[log in to unmask]] On Behalf Of Syed Ahmad
>> Sent: Tuesday, April 14, 2015 2:34 PM
>> To: [log in to unmask]
>> Subject: Re: [TN] Copper Wire Bonds
>>
>> One may find copper wire coated with Pd to alleviate its corrosion.
>> Copper
>> does make intermetallics with Al but Kirkendall voiding does not occur
>> as
>> in
>> Au-Al bonds. Use of copper as wafer metallization is increasing and thus
>> so
>> is the use of copper wire.
>>
>> -----Original Message-----
>> From: TechNet [mailto:[log in to unmask]] On Behalf Of Wayne Thayer
>> Sent: Tuesday, April 14, 2015 8:21 AM
>> To: [log in to unmask]
>> Subject: Re: [TN] Copper Wire Bonds
>>
>> Hi Victor-
>>
>> Yes, copper wirebond technology is now available (I've only seen this
>> done
>> as ball bonding). We haven't upgraded our equipment for it as of yet,
>> but
>> the kit isn't real expensive. I understand that the balls are harder, so
>> cratering is probably seen more often. I don't know offhand what
>> temperature
>> the welding is done at.
>>
>> Aluminum is cheaper,  very easy to bond with (room temperature welding),
>> and
>> doesn't need cover gas. But only available as wedge bonding, which can't
>> match the pitch of balls.
>>
>> Wayne
>>
>> -----Original Message-----
>> From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez
>> Sent: Tuesday, April 14, 2015 9:01 AM
>> To: [log in to unmask]
>> Subject: [TN] Copper Wire Bonds
>>
>> Fellow TechNetters:
>>
>>    What is the story behind Copper Wire Bonds.   I have heard of them
>> but
>> now I have witness one.   Any details out there on this technology?   I
>> will
>> have to search archives.
>>
>> Victor,
>>
>>
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