One of our customers has us solder samples for lot-to-lot qualification of
devices packaged off shore. A several years ago one of the lots failed with
corrosion on and in the parts. Initially flux was suspected. It turned out
not be the case. It was a failure from poor processing control at the
package house. The corrosive agent was from inside the package.


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Dale Ritzen
Sent: Wednesday, February 11, 2015 5:25 PM
To: [log in to unmask]
Subject: [TN] Incursion of fluxes into electronic device packages

Hello Technetters,
Has anyone ever experienced issues with solder paste flux (or potentially
flux from cored wire solder or wave solder or selective solder processes)
penetrating into a chip package during reflow or cleaning or whatever? One
of our customers has asked about it and I know of no incidents like this.
Their question applies to all types of flux in general. But, I thought
someone out there may have run across this in their travels. 

I'm trying to figure out just how that could possibly happen with all the
package retooling for the higher temperature RoHS processes, but I will rely
on your vast experience and knowledge to provide the right answers.

I am waiting for all the "It depends..." answers to start rolling in!

Thank you in advance,
Dale Ritzen, ASQ CQA
Quality Manager / ISO Management representative
_____________________________ Austin Manufacturing Services

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