One of our customers has us solder samples for lot-to-lot qualification of devices packaged off shore. A several years ago one of the lots failed with corrosion on and in the parts. Initially flux was suspected. It turned out not be the case. It was a failure from poor processing control at the package house. The corrosive agent was from inside the package. -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Dale Ritzen Sent: Wednesday, February 11, 2015 5:25 PM To: [log in to unmask] Subject: [TN] Incursion of fluxes into electronic device packages Hello Technetters, Has anyone ever experienced issues with solder paste flux (or potentially flux from cored wire solder or wave solder or selective solder processes) penetrating into a chip package during reflow or cleaning or whatever? One of our customers has asked about it and I know of no incidents like this. Their question applies to all types of flux in general. But, I thought someone out there may have run across this in their travels. I'm trying to figure out just how that could possibly happen with all the package retooling for the higher temperature RoHS processes, but I will rely on your vast experience and knowledge to provide the right answers. I am waiting for all the "It depends..." answers to start rolling in! Thank you in advance, Dale Ritzen, ASQ CQA Quality Manager / ISO Management representative _____________________________ Austin Manufacturing Services ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________