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Date: | Fri, 19 Sep 2014 21:28:52 +0100 |
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Yes - the Sn forms the brittle intermetallic with the Au not the Pb.
Arguably the reduced Sn content makes the Sn/Bi more affected as any Au
present would be at a higher relative concentration to the Sn. In can be
subbed for the Sn to avoid the Sn/Au problem, but may have some issues with
Cu according to your joint materials. Low MP In based alloys are a little
slower to form joints than Sn based alloys and generally benefit from flux
designed for them.
Regards
Mike
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Vladimir Igoshev
Sent: Friday, September 19, 2014 2:17 PM
To: [log in to unmask]
Subject: [TN] Au embrittlement
?I'm trying to find information on whether Sn-Bi based solders are
susceptible to Au embrittlement in a similar way as Sn and Sn-Pb-based
solders do.
I don't see why they wouldn't but need some confirmation.
As always, thank you very much in advance for constructive answers.
Regards,
Vladimir
Sent from my BlackBerry 10 smartphone on the Rogers network.
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