Yes - the Sn forms the brittle intermetallic with the Au not the Pb. Arguably the reduced Sn content makes the Sn/Bi more affected as any Au present would be at a higher relative concentration to the Sn. In can be subbed for the Sn to avoid the Sn/Au problem, but may have some issues with Cu according to your joint materials. Low MP In based alloys are a little slower to form joints than Sn based alloys and generally benefit from flux designed for them. Regards Mike -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Vladimir Igoshev Sent: Friday, September 19, 2014 2:17 PM To: [log in to unmask] Subject: [TN] Au embrittlement ?I'm trying to find information on whether Sn-Bi based solders are susceptible to Au embrittlement in a similar way as Sn and Sn-Pb-based solders do. I don't see why they wouldn't but need some confirmation. As always, thank you very much in advance for constructive answers. Regards, Vladimir Sent from my BlackBerry 10 smartphone on the Rogers network. ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________