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Date: | Wed, 6 Aug 2014 14:02:04 -0500 |
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Hi Chris,
I don't think that EDS maps will tell you anything more than you can obtain from the optical photomicrographs of the cross section. Looks like a typical solder joint mechanical overstress. It certainly isn't a brittle fracture at a solder/IMC interface that one might expect after a sudden impact or drop test.
Regards,
George
George M. Wenger
Failure Signature & Characterization Lab LLC
609 Cokesbury Road, High Bridge, NJ 08829
(908) 638-8771 Home (732) 309-8964 Mobile
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-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Chris Mahanna
Sent: Wednesday, August 06, 2014 2:49 PM
To: [log in to unmask]
Subject: [TN] SJ fracture signature
We see hundreds of cracked solder joints every year, but I can't say that I've ever seen one quite like this. I have some suspicions, but I'll keep them to myself, as to not prejudice the crowd.
EDS maps are forthcoming.
This is a caught in-the-wild field failure of a 48-pin BGA Reballed to SnPb ENIG on board side Ni barrier on component side
http://stevezeva.homestead.com/45268-1.JPG
http://stevezeva.homestead.com/45268-2.JPG
http://stevezeva.homestead.com/45268-8.JPG
Thoughts? And Thanks to Steve!
Chris Mahanna
President, Technical Manager
Robisan Laboratory Inc.
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