Hi Chris, I don't think that EDS maps will tell you anything more than you can obtain from the optical photomicrographs of the cross section. Looks like a typical solder joint mechanical overstress. It certainly isn't a brittle fracture at a solder/IMC interface that one might expect after a sudden impact or drop test. Regards, George George M. Wenger Failure Signature & Characterization Lab LLC 609 Cokesbury Road, High Bridge, NJ 08829 (908) 638-8771 Home (732) 309-8964 Mobile E-mail [log in to unmask] [log in to unmask] -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Chris Mahanna Sent: Wednesday, August 06, 2014 2:49 PM To: [log in to unmask] Subject: [TN] SJ fracture signature We see hundreds of cracked solder joints every year, but I can't say that I've ever seen one quite like this. I have some suspicions, but I'll keep them to myself, as to not prejudice the crowd. EDS maps are forthcoming. This is a caught in-the-wild field failure of a 48-pin BGA Reballed to SnPb ENIG on board side Ni barrier on component side http://stevezeva.homestead.com/45268-1.JPG http://stevezeva.homestead.com/45268-2.JPG http://stevezeva.homestead.com/45268-8.JPG Thoughts? And Thanks to Steve! Chris Mahanna President, Technical Manager Robisan Laboratory Inc. ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________