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June 2014

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Subject:
From:
David Hillman <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, David Hillman <[log in to unmask]>
Date:
Mon, 16 Jun 2014 11:48:06 -0500
Content-Type:
text/plain
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text/plain (32 lines)
Hi Paul - It would be helpful if you have a couple of pictures for everyone
to look at, makes our recommendations more focused.

Dave


On Mon, Jun 16, 2014 at 10:52 AM, Paul Taylor <[log in to unmask]>
wrote:

> Hi
>
> new to the forum, although in a previous life I used it quite a lot!
>
> We use the Freescale MPC860DTCZQ50D4 in one of our designs, we've had a
> few issues with soldering at our sub-contractor which has got worse as we
> just don't seem to be able to lock down the root cause.
> We have other BGA's on the boards (different pitches) which solder ok
>
> The problem is always the outer pins in the corners , I've a lot of infor
> on the tests we have done, but I had seem a post about contamination of the
> balls on the Motorola package, which to be frank I hadn't considered
>
> I've also seen some info about substrate changes which I'm wondering if it
> also was connected
>


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