Dear Technetters,

 

We have an issue with BGA and vias in pad and the usual flatness required
for assembly and Solderjetting.

The IPC-6012C for Class 3, says it is acceptable for Dimples up to 75µm and
bumps up to 50µm …

 

At the assembly line, they do not want Bumps and almost no Dimples (max
25µm) 

 

Do we have any Pro/Con experiences as to where to lead and define boundaries
for it?

Is there some more specs in regard of SolderJetting ?

 

Thank you for your help

 

Best Regards

Roland

 

 

 

 


______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________