Dear Technetters, We have an issue with BGA and vias in pad and the usual flatness required for assembly and Solderjetting. The IPC-6012C for Class 3, says it is acceptable for Dimples up to 75µm and bumps up to 50µm … At the assembly line, they do not want Bumps and almost no Dimples (max 25µm) Do we have any Pro/Con experiences as to where to lead and define boundaries for it? Is there some more specs in regard of SolderJetting ? Thank you for your help Best Regards Roland ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________