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Date: | Tue, 6 May 2014 06:52:49 +0000 |
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Hi Jim,
when your process is fine you do not need x-ray! We have produced many boards with BGAs up to 600 balls for Motorola (3/4 G mobiles)several k a day, all components under shielding soldered in one reflow process forcing any repair to change the production into red! So we would recommend to setup process control with stencil/paste control by volume measurement, 100% AOI control BGA paste printing, pick and place with x/y/z measurement and closed short control loop and reflow temperature control.
Good luck,
Torsten
Best Regards
KRISTRONICS GmbH
Torsten Hagge
team leader HW development &
tech. projectmanager
Gewerbegrund 5-9
24955 Harrislee
Telefon +49 (0) 461 7741-624
Telefax +49 (0) 461 7741-642
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www.kristronics.de
Place of jurisdiction: Flensburg, commercial register: HRB 1433 FL
CEO Dipl.-Ing. oec. Thormod Ohm
VAD-Id DE 811182059
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-----Ursprüngliche Nachricht-----
Von: TechNet [mailto:[log in to unmask]] Im Auftrag von Jim West
Gesendet: Montag, 5. Mai 2014 16:26
An: [log in to unmask]
Betreff: [TN] Production with BGA's
Hi everyone,
A happy Monday to you all!
How many of you have experience with BGA's? We are looking at possibly having new designs that require BGA's. I have never ran, nor has my currently company, ran a process with BGA's and I'm trying to get my hands around everything needed to be successful. I believe my biggest concern will be the soldering process (material and process) and inspection afterwards. I feel pretty confident my paste printer, pick and place and reflow process will be capable of handling the BGA process based on feedback from the equipment manufacturers for those machines. I know this is a very broad question, but what do you guys think my focus should be on based on your experience? I have some time to prepare, so any feedback will be greatly appreciated. One specific question I do have is, will I need 100% X-Ray inspection?
Thanks,
Jim
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