Agree. The old mil spec call out soft gold electrolytic plating, it is good for themosonic or thermocompression bonding with relatively thick gold wire (using today's standard). That is when the gold is in 260 to 400 dollar range. Currently, you can't do that for fine pitch wire bonding. You need to match your wire hardness to the substrate, wire usually harder than the old 99.9 gold, in order to keep long wire loop fine pitch to stay in place. Select a surface finishing without select the wire, capillary and border may cause you headache on the floor. In addition, if you work on high end of package, with >500 wire bonds per device. The yield is the killer, mismatch substrate will kill the production (unless you have pot of gold to spare). My 1.76 cents.
"All professional skills are mastered by critiqued practice" - by Schon.
Original Message
From: Steven Creswick
Sent: Wednesday, February 5, 2014 8:49 PM
To: [log in to unmask]
Reply To: TechNet E-Mail Forum
Subject: Re: [TN] Wire Bonding Spec?
Wayne,
Amen!
Steve C
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Wayne Thayer
Sent: Wednesday, February 05, 2014 7:44 PM
To: [log in to unmask]
Subject: Re: [TN] Wire Bonding Spec?
I don't want to get in some kind of on line spat over this, but I recommend
that whoever is doing the wirebonding calls out the surface finish! If that
person has any experience, they will only commit to the finish after the
vendor provides a sample they can test with. For many this would not be
enough and they would send it out to a lab for full analysis so they can use
it as a baseline and verify that the actual production boards have the same
finish.
Wirebonding issues mostly have to do with surface finish and contamination:
Solve those and generally you can have a pretty good day!
Wayne Thayer
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Kenneth Wood
Sent: Wednesday, February 05, 2014 6:51 PM
To: [log in to unmask]
Subject: Re: [TN] Wire Bonding Spec?
Jack,
Use ENEPIG surface finish. A bit pricey but pretty good for wire bonding.
Ken
_____________________________________
Kenneth J. Wood
Saturn PCB Design, Inc.
[log in to unmask]
(407) 340-2668
www.saturnpcb.com
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Jack Olson
Sent: Wednesday, January 29, 2014 4:17 PM
To: [log in to unmask]
Subject: [TN] Wire Bonding Spec?
newbie question:
Do any IPC publications discuss wire bonding?
What we are trying to do is similar to COB, but this is a new subject for
us...
thanks,
Jack
______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
|
