Please define "delamination."  Per what spec, what size, where located, etc

2 cases in 20 years is an extremely, virtually unheard-of, record. 
"Delamination" as such, from all sources, is at least a weekly  event in 
flex circuitry (said from 50 years' experience).  Polyimide films and some 
flex circuit adhesives are deliquescent ie have significant moisture 
absorption and gain moisture very quickly after dessicated. Pre high-heat 
exposure bake-out or dessication is absolutely required together with tight 
time  limits to solder assembly  or other high temp exposure.

T H Stearns
3 Brander Court
Nashua, NH 03063 


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