you should also post this to the IPC TechNet forum

send an email with no subject line to [log in to unmask]

in the body "subscribe Technet (yourname)"

you might also want to "set digest on" to combine all the posts into one
per day


On Tue, Oct 1, 2013 at 9:11 AM, Tom Stearns <[log in to unmask]>wrote:

> Please define "delamination."  Per what spec, what size, where located, etc
>
> 2 cases in 20 years is an extremely, virtually unheard-of, record.
> "Delamination" as such, from all sources, is at least a weekly  event in
> flex circuitry (said from 50 years' experience).  Polyimide films and some
> flex circuit adhesives are deliquescent ie have significant moisture
> absorption and gain moisture very quickly after dessicated. Pre high-heat
> exposure bake-out or dessication is absolutely required together with tight
> time  limits to solder assembly  or other high temp exposure.
>
> T H Stearns
> 3 Brander Court
> Nashua, NH 03063
>
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