TGASIA Archives

July 2013

TGAsia@IPC.ORG

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Subject:
From:
Jessie GUO <[log in to unmask]>
Reply To:
Jessie GUO <[log in to unmask]>
Date:
Fri, 12 Jul 2013 07:00:24 +0000
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大家好!



[log in to unmask]是一个邮件论坛,是为业界专业人员提供交流技术问题、最佳实践经验的平台,可以用来寻找供应商;也是IPC为业界提供免费技术资源的渠道。

寻找供应商的邮件,请在邮件中列明自己的联系方式,方便供应商主动找到您。



提供供应服务的邮件,请私下联络,不要发给[log in to unmask]<mailto:不要发给[log in to unmask]>邮件论坛中,以免对他人造成困扰。



对于在TGAsia论坛中,发布供应信息的发件人,我们会把您从此论坛中移出,以免您对其他1000多位人员造成信息困扰。



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谢谢配合!





With Best Regards,

Jessie

IPC China



________________________________

发件人: TGAsia [mailto:[log in to unmask]] 代表 George fu

发送时间: 2013年7月12日 10:50

收件人: [log in to unmask]<mailto:[log in to unmask]>

主题: [TGAsia] PCB供应商寻找



东莞深圳附近的PCB工厂请联系我,

我想做PCB板,有资料可以提供给你报价。

数量:10K~50K



发件人: TGAsia [mailto:[log in to unmask]] 代表 me-zyzhu

发送时间: 2013年7月12日 10:28

收件人: [log in to unmask]<mailto:[log in to unmask]>

主题: Re: [TGAsia] 为何PCB板的BGA总是吃锡不良



1.  通过实验得出,焊接前的焊盘拉力,不同温度焊接后的焊盘拉力。

2.  向合作伙伴讨论拉力变化,和安全操做范围。

3.  按安全范围操做进行验证。

如结论是膨胀系数差异太大,可与客人商量换PCB板材。



________________________________

From: TGAsia [mailto:[log in to unmask]]<mailto:%5bmailto:[log in to unmask]> On Behalf Of L榴??香

Sent: Friday, July 12, 2013 10:17 AM

To: [log in to unmask]<mailto:[log in to unmask]>

Subject: Re: [TGAsia] 为何PCB板的BGA总是吃锡不良



因为我们只是加工,对于PCB板的这些情况也不是很了解,确实也需要了解,

才能从根本上杜绝。





From: Wei, Joy<mailto:[log in to unmask]>

Sent: Friday, July 12, 2013 10:06 AM

To: [log in to unmask]<mailto:[log in to unmask]>

Subject: Re: [TGAsia] 为何PCB板的BGA总是吃锡不良



PCB 设计方面优化: 1) 加大焊盘设计 。  2)在PCB板上,跟焊盘相连接的铜皮走线尽量加粗。 3)PCB 板材的CTE –X,Y 轴的膨胀系数尽量跟铜皮的膨胀系数一致,建议问问PCB板厂,该PCB板材的膨胀系数如何。如果差异太大,换PCB板材。

Joy

From: TGAsia [mailto:[log in to unmask]]<mailto:%5bmailto:[log in to unmask]> On Behalf Of Johnny Man

Sent: Friday, July 12, 2013 9:52 AM

To: [log in to unmask]<mailto:[log in to unmask]>

Subject: Re: [TGAsia] 为何PCB板的BGA总是吃锡不良



我认为导线太硬,焊盘太小。焊好以后不能用力动导线。设计方面可以加大焊盘。

Johnny Man (Echelon)

From: TGAsia [mailto:[log in to unmask]<mailto:[log in to unmask]>] On Behalf Of me-zyzhu

Sent: Friday, July 12, 2013 9:44 AM

To: [log in to unmask]<mailto:[log in to unmask]>

Subject: Re: [TGAsia] 为何PCB板的BGA总是吃锡不良



特别留意到一点,焊盘和PCB材质的受热膨胀系数是不是差异较大。



________________________________

From: L榴莲飘香 [mailto:[log in to unmask]]

Sent: Friday, July 12, 2013 9:40 AM

To: me-zyzhu; [log in to unmask]<mailto:[log in to unmask]>

Subject: Re: [TGAsia] 为何PCB板的BGA总是吃锡不良



是单层板,焊接温度设定的是380℃,时间是3s,

到客户那,轻轻摇一下就掉了。



这种铜箔的在PCB板上的附着力有没有可以检测的?



From: me-zyzhu<mailto:[log in to unmask]>

Sent: Friday, July 12, 2013 9:37 AM

To: 'L榴莲飘香'<mailto:[log in to unmask]> ; [log in to unmask]<mailto:[log in to unmask]>

Subject: RE: [TGAsia] 为何PCB板的BGA总是吃锡不良



多方面原因,单层板,焊盘的强度不够,焊接温度时间过长,摆放运输受外力等,都会引起焊盘脱落。



________________________________

From: TGAsia [mailto:[log in to unmask]] On Behalf Of L榴??香

Sent: Friday, July 12, 2013 9:18 AM

To: [log in to unmask]<mailto:[log in to unmask]>

Subject: Re: [TGAsia] 为何PCB板的BGA总是吃锡不良



各位



请教一下,以下这种焊点脱落是怎么回事呢。

铜箔也一起脱掉了。



[image]





From: York Yin<mailto:[log in to unmask]>

Sent: Friday, July 12, 2013 8:31 AM

To: [log in to unmask]<mailto:[log in to unmask]>

Subject: Re: [TGAsia] 为何PCB板的BGA总是吃锡不良



Dear,

這應該是一般的SMT制程問題,BGA吃錫不良原因眾多(材料-如氧化,錫球變形,PCB變形,PAD臟污等因素, 制程-如profile,錫膏控制等).

看你的照片應該是在X-Ray檢查發現BGA吃錫不良後, 經過再次重熔後取下BGA後分析的照片, 這樣已經破壞了不良現象(不良的錫球又重熔一次), 不好再進行分析..

建議可以取X-Ray打下的不良品:先排除PCB變形-->直接撬掉BGA(小心損壞),高倍顯微鏡下觀查臟污/氧化, EDX分析等-->觀查BGA/PAD其它錫球的焊接效果及成形效果與不良錫球對比,排除Profile等制程影響…做了上面肯定可以找到蛛絲馬跡.(微切片,染色也可以利用)



From: TGAsia [mailto:[log in to unmask]] On Behalf Of tiger

Sent: Thursday, July 11, 2013 10:30 PM

To: [log in to unmask]<mailto:[log in to unmask]>

Subject: [TGAsia] 为何PCB板的BGA总是吃锡不良



发件人: tiger<mailto:[log in to unmask]>

发送时间: 2013-07-11 21:41

收件人: [log in to unmask]<mailto:[log in to unmask]>

主题: 为何PCB板的BGA总是吃锡不良

诸位,



为何PCB板的BGA总是吃锡不良 ?

见附图片。



________________________________



Tiger



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