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I have a rhetorical question.
The bromine compounds in FR4 are bound by covalent bonds into the epoxy
structure and are theoretically harmless, at least until they reach
decomposition temperature.
Filler materials may have sulfur bound into their molecules either
covalently or ionically, but always another relatively small molecule
which is not integral in the epoxy structure.
Surely, these two cases cannot be considered as similar???
Brian
On 07.05.2013 15:46, Victor Hernandez wrote:
> Fellow TechNetters:
>
> We are doing some preliminary investigation of solder mask and have found out that it contains low levels of sulfur. Not sure what sulfur constituents. Is This a typical finding of sulfur?
>
> Victor,
>
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