I have a rhetorical question.

The bromine compounds in FR4 are bound by covalent bonds into the epoxy 
structure and are theoretically harmless, at least until they reach 
decomposition temperature.

Filler materials may have sulfur bound into their molecules either 
covalently or ionically, but always another relatively small molecule 
which is not integral in the epoxy structure.

Surely, these two cases cannot be considered as similar???

Brian

On 07.05.2013 15:46, Victor Hernandez wrote:
> Fellow TechNetters:
>
>     We are doing some preliminary investigation of solder mask and have found out that it contains low levels of sulfur.   Not sure what sulfur constituents.   Is This a typical finding of sulfur?
>
> Victor,
>
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