Same here Harvey. Glad to hear my former employer (when it was Lockheed Research Labs) is still doing good work.
One of their very clever inventions is what's called a "rubber mirror". It's a correcting element now in most astronomical telescopes. An old friend of mine, Nick Marshall, did the EE work to drive the many piezo elements supporting hexagonal mirror segments.
http://mthamilton.ucolick.org/public/research/AO/
Not many industrial research laboratories left in the USA. The first such lab was created by Thomas Edison, BTW.
We used to be a lot more competitive in the world. Transistors, lasers, cosmic background radiation, Shannon's work on communications theory....
Bob
Sent from my iPhone
On Apr 8, 2013, at 4:27 PM, harvey <[log in to unmask]> wrote:
> Yes, note that lead-free solder may not be used in space because of accelerated tin whiskering. Lockheed Space had an incentive to develop a replacement.
>
> As a veteran of the lost battle against the tin industry, I could not be happier that the war is not lost.
>
> --- On Mon, 4/8/13, Wayne Thayer <[log in to unmask]> wrote:
>
> From: Wayne Thayer <[log in to unmask]>
> Subject: Re: [TN] copper nanosolder--fyi
> To: [log in to unmask]
> Date: Monday, April 8, 2013, 12:04 PM
>
> Lockheed's stuff is focused on solder replacement, not Printed Electronics.
> ________________________________________
> From: TechNet [[log in to unmask]] on behalf of Mike Buetow [[log in to unmask]]
> Sent: Monday, April 08, 2013 2:45 PM
> To: [log in to unmask]
> Subject: Re: [TN] copper nanosolder--fyi
>
> Printed Electronics.
>
>
> Mike Buetow
>
>
> PCB CHAT: Come chat April 23 about the top 50 EMS Companies:
> www.pcbchat.com
>
>
>
>
> The 2013 CIRCUITS ASSEMBLY Directory of EMS Companies:
> circuitsassembly.com/dems
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Wayne Thayer
> Sent: Monday, April 08, 2013 2:05 PM
> To: [log in to unmask]
> Subject: Re: [TN] copper nanosolder--fyi
>
> PE?
> ________________________________________
> From: TechNet [[log in to unmask]] on behalf of Joyce Koo
> [[log in to unmask]]
> Sent: Monday, April 08, 2013 11:17 AM
> To: [log in to unmask]
> Subject: Re: [TN] copper nanosolder--fyi
>
> Double layer conduction? Might be shielding layer for EMI/EMC. That
> would be perfect application for PE.
>
> Joyce Koo
> Researcher
> Materials Interconnect Lab
> Office: (519) 888-7465 79945
> BlackBerry: (226) 220-4760
>
>
> -----Original Message-----
> From: Mike Fenner [mailto:[log in to unmask]]
> Sent: Monday, April 08, 2013 10:09 AM
> To: 'TechNet E-Mail Forum'; Joyce Koo
> Subject: RE: [TN] copper nanosolder--fyi
>
> Good summary Joyce.
> I think its clear that PE, with or without nano will not be replacing high
> speed digital circuitry for some time yet, its opportunities are
> elsewhere.
> There are plenty of examples already. Having said that it's interesting to
> look at display technology and the additional printed circuitry applied to
> conventional metal track PCBs. That's kind of PE by the back door. To me
> PE is just a subset of 3D printing, added layer manufacturing, call it
> what you will, in fact is part of it.
>
> Regards
>
> Mike Fenner
> Bonding Services & Products
> M: +44 [0] 7810 526 317
> T: +44 [0] 1865 522 663
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Joyce Koo
> Sent: Monday, April 08, 2013 2:47 PM
> To: [log in to unmask]
> Subject: Re: [TN] copper nanosolder--fyi
>
> Many thanks Harvey. I would very much interest to know the detail of the
> presentation. The nano particles are utilized in printed electronics, in
> various elements and organic conductive media to improve conductivity and
> flexibility. Normally, printed electronics are processed in low
> temperature with large surface contact area (roll to roll printing).
> Therefore, it can be flexible and thin, the resistance short coming of the
> nano-particles due its large surface/interface characteristics (sometimes,
> it is hopping rather than normal conduction mechanism) are compensated by
> large conduction contact surfaces and thin joints.
>
> Sintering/fusing of the nano-particle can be done at lower temperature due
> to highly active surface energy, however, unless performed under pressure,
> you might get un-controlled re-crystallization and growth of the grain,
> resulted preferential growth of certain orientation of grain and leave
> some voids behind (low angle co-incidence grain boundary, as well as
> twining, are stable boundary, but not high angle gain boundary)- you might
> get more conductivity loss in high frequency and resistance increase. Of
> course, all the oxidation must be taking care of (copper is very readily
> oxidized, even with OSP coated, with that much surface area (nano
> particle). Acid media is more less like a flux can take care some of
> surface oxidation, but you still need to control the coalescence and
> growth (not all orientation are grow at same rate...).
>
> The existing solder interconnect is heading towards smaller, more compact
> (solid) joints, for example, flip chip, or TSV for high speed, high
> density interconnect (in line with the high density IC with node of <20
> nm). The solder interconnect joints more in the 3D stack, rather than 2D
> in printed electronics. High surface/interface might be good for some
> application, such as low frequency, low temperature application, I am a
> bit curious how it can be apply to the high frequency, high I/O, short and
> dense interconnect at lower voltage, and high device temperature (current
> processor dissipated 40-100W in some cases). Looking forward to see the
> presentation (I would really appreciated if you can share with us). I
> haven't been in the field for long time, Looking forward to update my
> knowledge. Thanks. My 2 cents.
> Best regards,
>
>
>
>
> Joyce Koo
> Researcher
> Materials Interconnect Lab
> Office: (519) 888-7465 79945
> BlackBerry: (226) 220-4760
>
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of harvey
> Sent: Saturday, April 06, 2013 9:16 PM
> To: [log in to unmask]
> Subject: [TN] copper nanosolder--fyi
>
> Biltmore Santa Clara for dinner (or non-dinner)
> June 12, 2013.
>
> Dr. Zinn's bio and abstract are at the end.
> Lockheed's nano-copper solder is an answer to the lead-free
> solder
> fiasco.
> Remember "the non-solution to the non-problem", that
> is, until we get rid of most solder altogether, most solder
> paste,
> anyhow.
>
>
>
>
>
> Speaker:
> Alfred Zinn, Lockheed Martin Space
> System Company ATC, Senior Scientist
>
> Abstract:
>
> NanoCopper Materials Platform for Electronic
> Packaging and Printed Electronics with 200 °C Processing
> Temperature
>
> The Advanced Technology Center of the Lockheed Martin
> Corporation has developed a nanocopper-based material
> that can
> be fused to bulk copper around 200 °C taking advantage
> of the
> rapidly decreasing fusion temperature with decreasing
> particle
> size at the nanoscale. The nanocopper material has the
> potential to replace tin-based solder to eliminate
> whisker
>
> growth and mechanical reliability concerns encountered
> with
> current lead-free solder. Fully optimized, the fused
> copper is
> expected to exhibit 10-15x electrical and thermal
> conductivity
> improvements over tin-based materials currently in use.
> The
> materials platform is enabled by our scalable Cu
> nanoparticle
> fabrication process employing a low cost solution-phase
> chemical reduction approach. A proprietary mixture of
> surfactants controls particle size and size distribution
> as
> well as stabilizing the particles preventing particle
> growth
> and oxidation, which would otherwise degrade its
> activity.
> We
> have demonstrated assembly of fully functional LED test
> boards
> using a paste formulated with nanocopper that exhibits a
> consistency very similar to standard tin-based solder
> paste.
> To date, we have demonstrated 26-pin through-hole
> connector
> assembly and a variety of surface mount components. We
> demonstrated feasibility of drop-in solder replacement
> using
> standard stencil and pick & place packaging equipment as
> well as demonstrated feasibility of using the material
> for
>
> printed electronics applications.
>
>
> Dr. Zinn
> received his Doctor of Science degree in Chemistry in
> 1990
>
> from the Philipps University, Marburg, Germany.
> Following
> completion of his graduate studies, Dr. Zinn spent five
> years
> at UCLA as a lecturer and conducting postdoctoral
> research on
> low-temperature CVD for interconnect, diffusion, and
> migration
> barrier deposition, as well as magnetic nanomaterials
> design
> and synthesis. In 2004, he joined Lockheed Martin Space
> Systems Company Advanced technology Center in Palo Alto,
> CA
> developing high-temperature materials systems,
> nanostructured
> functional materials (electrical, thermal,
> thermoelectric),
> modeling quantum/superlattice structures and devices,
> high
>
> performance energy conversion devices (solar, high & low
> quality heat conversion). He holds seven patents in
> materials,
> structures and processing, two THz technology patents,
> with
> ten additional patents pending (multiple international
> filings) as well as four trade secrets. He has authored
> or
>
> co-authored over 20 archival journal publications,
> including
> book chapters in "The Chemistry of Metal CVD" as well as
> the
> "Encyclopedia of Inorganic
> Chemistry.
>
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