Same here Harvey. Glad to hear my former employer (when it was Lockheed Research Labs) is still doing good work. One of their very clever inventions is what's called a "rubber mirror". It's a correcting element now in most astronomical telescopes. An old friend of mine, Nick Marshall, did the EE work to drive the many piezo elements supporting hexagonal mirror segments. http://mthamilton.ucolick.org/public/research/AO/ Not many industrial research laboratories left in the USA. The first such lab was created by Thomas Edison, BTW. We used to be a lot more competitive in the world. Transistors, lasers, cosmic background radiation, Shannon's work on communications theory.... Bob Sent from my iPhone On Apr 8, 2013, at 4:27 PM, harvey <[log in to unmask]> wrote: > Yes, note that lead-free solder may not be used in space because of accelerated tin whiskering. Lockheed Space had an incentive to develop a replacement. > > As a veteran of the lost battle against the tin industry, I could not be happier that the war is not lost. > > --- On Mon, 4/8/13, Wayne Thayer <[log in to unmask]> wrote: > > From: Wayne Thayer <[log in to unmask]> > Subject: Re: [TN] copper nanosolder--fyi > To: [log in to unmask] > Date: Monday, April 8, 2013, 12:04 PM > > Lockheed's stuff is focused on solder replacement, not Printed Electronics. > ________________________________________ > From: TechNet [[log in to unmask]] on behalf of Mike Buetow [[log in to unmask]] > Sent: Monday, April 08, 2013 2:45 PM > To: [log in to unmask] > Subject: Re: [TN] copper nanosolder--fyi > > Printed Electronics. > > > Mike Buetow > > > PCB CHAT: Come chat April 23 about the top 50 EMS Companies: > www.pcbchat.com > > > > > The 2013 CIRCUITS ASSEMBLY Directory of EMS Companies: > circuitsassembly.com/dems > > -----Original Message----- > From: TechNet [mailto:[log in to unmask]] On Behalf Of Wayne Thayer > Sent: Monday, April 08, 2013 2:05 PM > To: [log in to unmask] > Subject: Re: [TN] copper nanosolder--fyi > > PE? > ________________________________________ > From: TechNet [[log in to unmask]] on behalf of Joyce Koo > [[log in to unmask]] > Sent: Monday, April 08, 2013 11:17 AM > To: [log in to unmask] > Subject: Re: [TN] copper nanosolder--fyi > > Double layer conduction? Might be shielding layer for EMI/EMC. That > would be perfect application for PE. > > Joyce Koo > Researcher > Materials Interconnect Lab > Office: (519) 888-7465 79945 > BlackBerry: (226) 220-4760 > > > -----Original Message----- > From: Mike Fenner [mailto:[log in to unmask]] > Sent: Monday, April 08, 2013 10:09 AM > To: 'TechNet E-Mail Forum'; Joyce Koo > Subject: RE: [TN] copper nanosolder--fyi > > Good summary Joyce. > I think its clear that PE, with or without nano will not be replacing high > speed digital circuitry for some time yet, its opportunities are > elsewhere. > There are plenty of examples already. Having said that it's interesting to > look at display technology and the additional printed circuitry applied to > conventional metal track PCBs. That's kind of PE by the back door. To me > PE is just a subset of 3D printing, added layer manufacturing, call it > what you will, in fact is part of it. > > Regards > > Mike Fenner > Bonding Services & Products > M: +44 [0] 7810 526 317 > T: +44 [0] 1865 522 663 > -----Original Message----- > From: TechNet [mailto:[log in to unmask]] On Behalf Of Joyce Koo > Sent: Monday, April 08, 2013 2:47 PM > To: [log in to unmask] > Subject: Re: [TN] copper nanosolder--fyi > > Many thanks Harvey. I would very much interest to know the detail of the > presentation. The nano particles are utilized in printed electronics, in > various elements and organic conductive media to improve conductivity and > flexibility. Normally, printed electronics are processed in low > temperature with large surface contact area (roll to roll printing). > Therefore, it can be flexible and thin, the resistance short coming of the > nano-particles due its large surface/interface characteristics (sometimes, > it is hopping rather than normal conduction mechanism) are compensated by > large conduction contact surfaces and thin joints. > > Sintering/fusing of the nano-particle can be done at lower temperature due > to highly active surface energy, however, unless performed under pressure, > you might get un-controlled re-crystallization and growth of the grain, > resulted preferential growth of certain orientation of grain and leave > some voids behind (low angle co-incidence grain boundary, as well as > twining, are stable boundary, but not high angle gain boundary)- you might > get more conductivity loss in high frequency and resistance increase. Of > course, all the oxidation must be taking care of (copper is very readily > oxidized, even with OSP coated, with that much surface area (nano > particle). Acid media is more less like a flux can take care some of > surface oxidation, but you still need to control the coalescence and > growth (not all orientation are grow at same rate...). > > The existing solder interconnect is heading towards smaller, more compact > (solid) joints, for example, flip chip, or TSV for high speed, high > density interconnect (in line with the high density IC with node of <20 > nm). The solder interconnect joints more in the 3D stack, rather than 2D > in printed electronics. High surface/interface might be good for some > application, such as low frequency, low temperature application, I am a > bit curious how it can be apply to the high frequency, high I/O, short and > dense interconnect at lower voltage, and high device temperature (current > processor dissipated 40-100W in some cases). Looking forward to see the > presentation (I would really appreciated if you can share with us). I > haven't been in the field for long time, Looking forward to update my > knowledge. Thanks. My 2 cents. > Best regards, > > > > > Joyce Koo > Researcher > Materials Interconnect Lab > Office: (519) 888-7465 79945 > BlackBerry: (226) 220-4760 > > > -----Original Message----- > From: TechNet [mailto:[log in to unmask]] On Behalf Of harvey > Sent: Saturday, April 06, 2013 9:16 PM > To: [log in to unmask] > Subject: [TN] copper nanosolder--fyi > > Biltmore Santa Clara for dinner (or non-dinner) > June 12, 2013. > > Dr. Zinn's bio and abstract are at the end. > Lockheed's nano-copper solder is an answer to the lead-free > solder > fiasco. > Remember "the non-solution to the non-problem", that > is, until we get rid of most solder altogether, most solder > paste, > anyhow. > > > > > > Speaker: > Alfred Zinn, Lockheed Martin Space > System Company ATC, Senior Scientist > > Abstract: > > NanoCopper Materials Platform for Electronic > Packaging and Printed Electronics with 200 °C Processing > Temperature > > The Advanced Technology Center of the Lockheed Martin > Corporation has developed a nanocopper-based material > that can > be fused to bulk copper around 200 °C taking advantage > of the > rapidly decreasing fusion temperature with decreasing > particle > size at the nanoscale. The nanocopper material has the > potential to replace tin-based solder to eliminate > whisker > > growth and mechanical reliability concerns encountered > with > current lead-free solder. Fully optimized, the fused > copper is > expected to exhibit 10-15x electrical and thermal > conductivity > improvements over tin-based materials currently in use. > The > materials platform is enabled by our scalable Cu > nanoparticle > fabrication process employing a low cost solution-phase > chemical reduction approach. A proprietary mixture of > surfactants controls particle size and size distribution > as > well as stabilizing the particles preventing particle > growth > and oxidation, which would otherwise degrade its > activity. > We > have demonstrated assembly of fully functional LED test > boards > using a paste formulated with nanocopper that exhibits a > consistency very similar to standard tin-based solder > paste. > To date, we have demonstrated 26-pin through-hole > connector > assembly and a variety of surface mount components. We > demonstrated feasibility of drop-in solder replacement > using > standard stencil and pick & place packaging equipment as > well as demonstrated feasibility of using the material > for > > printed electronics applications. > > > Dr. Zinn > received his Doctor of Science degree in Chemistry in > 1990 > > from the Philipps University, Marburg, Germany. > Following > completion of his graduate studies, Dr. Zinn spent five > years > at UCLA as a lecturer and conducting postdoctoral > research on > low-temperature CVD for interconnect, diffusion, and > migration > barrier deposition, as well as magnetic nanomaterials > design > and synthesis. In 2004, he joined Lockheed Martin Space > Systems Company Advanced technology Center in Palo Alto, > CA > developing high-temperature materials systems, > nanostructured > functional materials (electrical, thermal, > thermoelectric), > modeling quantum/superlattice structures and devices, > high > > performance energy conversion devices (solar, high & low > quality heat conversion). He holds seven patents in > materials, > structures and processing, two THz technology patents, > with > ten additional patents pending (multiple international > filings) as well as four trade secrets. He has authored > or > > co-authored over 20 archival journal publications, > including > book chapters in "The Chemistry of Metal CVD" as well as > the > "Encyclopedia of Inorganic > Chemistry. > > ______________________________________________________________________ > This email has been scanned by the Symantec Email Security.cloud service. > For more information please contact helpdesk at x2960 or [log in to unmask] > ______________________________________________________________________ > > --------------------------------------------------------------------- > This transmission (including any attachments) may contain confidential > information, privileged material (including material protected by the > solicitor-client or other applicable privileges), or constitute non-public > information. Any use of this information by anyone other than the intended > recipient is prohibited. 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