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October 2012

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From:
Ioan Tempea <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ioan Tempea <[log in to unmask]>
Date:
Tue, 23 Oct 2012 13:02:17 +0000
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Hi Dave,

I don't even know if I should consider the application, since we've assembled certain gilded pins on some boards, shelved them and we see Cu diffusion, after a few months, although the boards were never fired up. And the Ni thickness is about 50 microinches.

Quite a puzzle!

Thanks,

Ioan Tempea, ing.
Ingénieur principal de fabrication / Senior Manufacturing Engineer
[signature002]<http://www.digico.cc/>

950 RUE BERGAR, LAVAL, QC, H7L 5A1<http://g.co/maps/2gh3f>
T+ 1 (450) 967-7100, EXT244
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  [signature001] <http://www.facebook.com/pages/Digico/277076778479>
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Lauréat Dunamis 2012<http://digico.cc/dunamis-2012/>
Entreprise manufacturière / Gestion du capital humain

De : [log in to unmask] [mailto:[log in to unmask]]
Envoyé : October-23-12 8:55 AM
À : TechNet E-Mail Forum; Ioan Tempea
Objet : Re: [TN] Ni barrier thickness

Hi Ioan - There is a difference between a specified nickel thickness and a necessary nickel thickness. As other Technetees has detailed, components and boards will have a nickel thickness requirement per their individual specifications and/or their specific application (i.e. contact , wirebond, corrosion, etc.). Nickel is a very good diffusion barrier with respect to copper so 20-30 microinches is sufficient as a diffusion barrier. However, there are other inputs to the necessary thickness recipe which may dictate a greater thickness. Do you have a specific application in mind?

Dave Hillman
Rockwell Collins
[log in to unmask]<mailto:[log in to unmask]>



From:        Ioan Tempea <[log in to unmask]<mailto:[log in to unmask]>>
To:        <[log in to unmask]<mailto:[log in to unmask]>>
Date:        10/22/2012 02:35 PM
Subject:        [TN] Ni barrier thickness
Sent by:        TechNet <[log in to unmask]<mailto:[log in to unmask]>>
________________________________



Dear Technos,

For applications other than ENIG, like, for instance, gold plated Cu pins, is there any standard (ASTM?) specifying the thickness of the Ni barrier that would prevent Cu diffusion towards the surface?

Thank you,

Ioan Tempea, ing.
Ingénieur principal de fabrication / Senior Manufacturing Engineer
[signature002]<http://www.digico.cc/>

950 RUE BERGAR, LAVAL, QC, H7L 5A1<http://g.co/maps/2gh3f>
T+ 1 (450) 967-7100, EXT244
------------------------------------------------------------------------
 [signature001] <http://www.facebook.com/pages/Digico/277076778479>
------------------------------------------------------------------------
Lauréat Dunamis 2012<http://digico.cc/dunamis-2012/>
Entreprise manufacturière / Gestion du capital humain


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