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Date: | Mon, 22 Oct 2012 19:33:27 +0000 |
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Dear Technos,
For applications other than ENIG, like, for instance, gold plated Cu pins, is there any standard (ASTM?) specifying the thickness of the Ni barrier that would prevent Cu diffusion towards the surface?
Thank you,
Ioan Tempea, ing.
Ingénieur principal de fabrication / Senior Manufacturing Engineer
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T+ 1 (450) 967-7100, EXT244
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Entreprise manufacturière / Gestion du capital humain
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