Hi Ioan - There is a difference between a specified nickel thickness and a 
necessary nickel thickness. As other Technetees has detailed, components 
and boards will have a nickel thickness requirement per their individual 
specifications and/or their specific application (i.e. contact , wirebond, 
corrosion, etc.). Nickel is a very good diffusion barrier with respect to 
copper so 20-30 microinches is sufficient as a diffusion barrier. However, 
there are other inputs to the necessary thickness recipe which may dictate 
a greater thickness. Do you have a specific application in mind?

Dave Hillman
Rockwell Collins
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From:   Ioan Tempea <[log in to unmask]>
To:     <[log in to unmask]>
Date:   10/22/2012 02:35 PM
Subject:        [TN] Ni barrier thickness
Sent by:        TechNet <[log in to unmask]>



Dear Technos,

For applications other than ENIG, like, for instance, gold plated Cu pins, 
is there any standard (ASTM?) specifying the thickness of the Ni barrier 
that would prevent Cu diffusion towards the surface?

Thank you,

Ioan Tempea, ing.
Ingénieur principal de fabrication / Senior Manufacturing Engineer
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