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September 2012

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Subject:
Re: Vias under a QFN package (Thermal Refief)
From:
grandrien <[log in to unmask]>
Reply To:
grandrien <[log in to unmask]>
Date:
Tue, 18 Sep 2012 15:12:41 +0200
Content-Type:
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Sorry not to be totally convinced. We had exactly opposite results. Actually with 0.5mm plated via diameter we had less wicking than with 0.4mm diameter vias 
under DPAK, QFN... 
The root cause according to us must be capillary actions.

No results with 0.3mm.

Nobody else with same experience ????

My 2 cents.

========================================
Message du 17/09/12 15:51
De : "Pete" 

A : [log in to unmask]
Copie à : 
Objet : Re: [DC] Vias under a QFN package (Thermal Refief)

larger holes actually increase solder wicking, especially with lead free. go smaller!

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