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September 2012

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Subject:
Re: Vias under a QFN package (Thermal Refief)
From:
"Brooks, William" <[log in to unmask]>
Reply To:
(Designers Council Forum)
Date:
Tue, 18 Sep 2012 17:22:46 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (1 lines) 
.25mm sounds like a good size for thermal vias under a thermal pad. 
Regardless of the solder type. 


William Brooks, CID+
Senior MTS (Temp) 
2747 Loker Ave West
Carlsbad, CA 92010-6603
760-930-7212
Fax:        760.918.8332
Mobile:    760.216.0170
E-mail:    [log in to unmask]




-----Original Message-----
From: DesignerCouncil [mailto:[log in to unmask]] On Behalf Of Pete
Sent: Tuesday, September 18, 2012 9:25 AM
To: [log in to unmask]
Subject: Re: [DC] Vias under a QFN package (Thermal Refief)

you say "better results", but still you are having problems.

Try .25mm vias.

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