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August 2012

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Subject:
From:
"Whittaker, Dewey (EHCOE)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Whittaker, Dewey (EHCOE)
Date:
Tue, 14 Aug 2012 17:14:43 +0000
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Kevin,
You shouldn't buy a pig in a poke, but I'd take ENEPIG any day rather than suffer the slings and arrows of uncertainties and potentially have hard gold be my final finish.
Dewey

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Glidden, Kevin
Sent: Tuesday, August 14, 2012 9:12 AM
To: [log in to unmask]
Subject: [TN] PCB finish: ENIG vs. hard gold

Hi everyone,

We have a PCB supplier who is offering "Hard Gold" as an alternate to ENIG finish, due to PCB size and processing capabilities.  The application is Class 3 (mil/aero).  The circuit is thin FR4 and subject to SMT reflow w/ Sn63Pb37 (non RoHS) solder alloy, and moderate flexing in end application.

Can anyone offer info on the differences between the two finishes, and/or their suitability?  Is there an IPC spec (or specs) that outline "hard gold"?

Thanks,

Kevin Glidden


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