Sender: |
|
X-To: |
|
Date: |
Tue, 14 Aug 2012 17:14:43 +0000 |
Reply-To: |
|
Message-ID: |
|
Subject: |
|
From: |
|
MIME-Version: |
1.0 |
In-Reply-To: |
|
Content-Transfer-Encoding: |
quoted-printable |
Content-Type: |
text/plain; charset="us-ascii" |
Parts/Attachments: |
|
|
Kevin,
You shouldn't buy a pig in a poke, but I'd take ENEPIG any day rather than suffer the slings and arrows of uncertainties and potentially have hard gold be my final finish.
Dewey
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Glidden, Kevin
Sent: Tuesday, August 14, 2012 9:12 AM
To: [log in to unmask]
Subject: [TN] PCB finish: ENIG vs. hard gold
Hi everyone,
We have a PCB supplier who is offering "Hard Gold" as an alternate to ENIG finish, due to PCB size and processing capabilities. The application is Class 3 (mil/aero). The circuit is thin FR4 and subject to SMT reflow w/ Sn63Pb37 (non RoHS) solder alloy, and moderate flexing in end application.
Can anyone offer info on the differences between the two finishes, and/or their suitability? Is there an IPC spec (or specs) that outline "hard gold"?
Thanks,
Kevin Glidden
______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
|
|
|