I participate in JEDEC and PCI work groups developing next generation upgrade memory, SSD and wireless modules for the PC industry. We are moving to smaller pitches with the modules that mate with edge card style connectors. Required tolerances and become an issue with regard to high volume manufacturing ability to maintain required dimensions. I would like to talk to anyone who can discuss with me PCB industry capability to hold these new tolerances. I can share JEDEC and PCI specs with whoever is interested.

Jim McGrath
Strategic Marketing Manager
TE Consumer Devices
Cell: 630-244-3872
Email: [log in to unmask]<mailto:[log in to unmask]>



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