I participate in JEDEC and PCI work groups developing next generation upgrade memory, SSD and wireless modules for the PC industry. We are moving to smaller pitches with the modules that mate with edge card style connectors. Required tolerances and become an issue with regard to high volume manufacturing ability to maintain required dimensions. I would like to talk to anyone who can discuss with me PCB industry capability to hold these new tolerances. I can share JEDEC and PCI specs with whoever is interested. Jim McGrath Strategic Marketing Manager TE Consumer Devices Cell: 630-244-3872 Email: [log in to unmask]<mailto:[log in to unmask]> ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________