Ah! To bake or not to bake, that is the question. Tis it nobler in the minds eye to suffer the slings and arrows of moisture ingression uncertainties or just go with the flow. When you say delaminate, was it just after reflow, flow soldering and/or hand soldering. Was it unique to an area or surface side? Do you believe the reflow profile was in accordance with those limits defined in IPC-TM-650, Method 2.6.27? Did the coupons that established lot acceptance of the PBs show evidence of this condition? Did the PBs come in the proper packaging and CoCs or did you just go by what the HIC said? If you have done this and want to bake, IPC-1601 is a good place to begin.

Dewey



-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Phil Nutting
Sent: Wednesday, August 15, 2012 7:40 AM
To: [log in to unmask]
Subject: [TN] bare board pre-bake parameters



Good morning all,



We have recently had some boards delaminate and are considering pre-baking as a possible solution.  I need to know some "rules of thumb" for pre-bake time and temperature, suggested atmosphere (dry nitrogen?), allowable time between pre-bake and soldering.



At the moment I only have minimal information on the boards so I don't know their physical size, number of layers or if they are SMT or PTH.



I realize it could be a bad batch and the problem may only be with one group of boards as this is not a common problem with boards form many of our fab houses or CMs.



Thanks in advance,



Phil Nutting

Design for Manufacturing Engineer

Kaiser Systems, Inc.

126 Sohier Road

Beverly, MA 01915

Phone: 978-922-9300 x1310

Fax: 978-922-8374

e-mail: [log in to unmask]<mailto:[log in to unmask]>

www.kaisersystems.com<http://www.kaisersystems.com>

www.linkedin.com/in/philnutting<http://www.linkedin.com/in/philnutting>





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