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July 2012

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TechNet <[log in to unmask]>
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Date:
Wed, 25 Jul 2012 14:47:54 +0800
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TechNet E-Mail Forum <[log in to unmask]>, Charming Chan <[log in to unmask]>
Subject:
Stress and strain analysis
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Charming Chan <[log in to unmask]>
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TechNet, 

To evaluate component reliability and solder joint reliability under mechanical force for components on a midplane board assembly, which spec or papers should I refer to for stress and strain testing when connectors mating/unmating between midplane and daughter card. Refer to spec IPC/JEDEC-9704? Any other papers recommended? Thanks.

Thanks a lot. 
Charming Chan

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