TechNet, To evaluate component reliability and solder joint reliability under mechanical force for components on a midplane board assembly, which spec or papers should I refer to for stress and strain testing when connectors mating/unmating between midplane and daughter card. Refer to spec IPC/JEDEC-9704? Any other papers recommended? Thanks. Thanks a lot. Charming Chan ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________