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Stephen,
To coin a well used phrase, "It all depends".
Most die bonders have the capability to check for ink dots since they have
to visually determine just where the die is anyway. Many/most also have the
capability to work from down-loaded wafer maps from the probe and test
operation.
It depends on what equipment you have...
Best regards.
Steve Creswick
Sr Associate - Balanced Enterprise Solutions
http://www.linkedin.com/in/stevencreswick
616 834 1883
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Stephen Ayotte
Sent: Tuesday, July 17, 2012 9:38 AM
To: [log in to unmask]
Subject: [TN] Module Build, Wafer picking capability
I am not sure who on the distribution performs module assembly but I have a
question for those who do.
Is your die picking tool capable of seeing a die with an ink dot indicating
the die is not to be picked.
Thanks.
Stephen Ayotte
Manufacturing Quality Engineer
Bldg. 966 - 2, Office 2J1309
Userid: Stephen Ayotte/Burlington/IBM
Internet id: [log in to unmask]
Phone: 802 769 4775
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