Stephen, To coin a well used phrase, "It all depends". Most die bonders have the capability to check for ink dots since they have to visually determine just where the die is anyway. Many/most also have the capability to work from down-loaded wafer maps from the probe and test operation. It depends on what equipment you have... Best regards. Steve Creswick Sr Associate - Balanced Enterprise Solutions http://www.linkedin.com/in/stevencreswick 616 834 1883 -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Stephen Ayotte Sent: Tuesday, July 17, 2012 9:38 AM To: [log in to unmask] Subject: [TN] Module Build, Wafer picking capability I am not sure who on the distribution performs module assembly but I have a question for those who do. Is your die picking tool capable of seeing a die with an ink dot indicating the die is not to be picked. Thanks. Stephen Ayotte Manufacturing Quality Engineer Bldg. 966 - 2, Office 2J1309 Userid: Stephen Ayotte/Burlington/IBM Internet id: [log in to unmask] Phone: 802 769 4775 ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________