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Date: | Thu, 10 May 2012 11:17:34 -0500 |
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Good morning all,
I am working on a draft of IPC-5703, titled " Cleanliness for
Fabricators", a kind of Cleanliness 101 for board fab houses. It should
be ready for wider review in a month or so, but you can see drafts of it
here.
http://www.ipc.org/CommitteeDetail.aspx?Committee=5-32C
So you will see several questions from me.
Question 1: In the board fabrication process (not the OEM/EMS assembly
process), have any of you ever seen residue accumulation on in-circuit
test pins or flying probe test pins which interfere with in-circuit test
continuity? Our board shop says it does not happen today. It was a more
common occurrence 10 years ago when HASL was more prevalent, but I don't
believe it happens today.
Agree or not, and why.
Thanks.
Doug Pauls
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