Good morning all, I am working on a draft of IPC-5703, titled " Cleanliness for Fabricators", a kind of Cleanliness 101 for board fab houses. It should be ready for wider review in a month or so, but you can see drafts of it here. http://www.ipc.org/CommitteeDetail.aspx?Committee=5-32C So you will see several questions from me. Question 1: In the board fabrication process (not the OEM/EMS assembly process), have any of you ever seen residue accumulation on in-circuit test pins or flying probe test pins which interfere with in-circuit test continuity? Our board shop says it does not happen today. It was a more common occurrence 10 years ago when HASL was more prevalent, but I don't believe it happens today. Agree or not, and why. Thanks. Doug Pauls ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________