Good morning all,

I am working on a draft of IPC-5703, titled " Cleanliness for 
Fabricators", a kind of Cleanliness 101 for board fab houses.  It should 
be ready for wider review in a month or so, but you can see drafts of it 
here.

http://www.ipc.org/CommitteeDetail.aspx?Committee=5-32C

So you will see several questions from me. 

Question 1:  In the board fabrication process (not the OEM/EMS assembly 
process), have any of you ever seen residue accumulation on in-circuit 
test pins or flying probe test pins which interfere with in-circuit test 
continuity?  Our board shop says it does not happen today.  It was a more 
common occurrence 10 years ago when HASL was more prevalent, but I don't 
believe it happens today.

Agree or not, and why.

Thanks.

Doug Pauls


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