Fellow TechNetters:
I am aware that D&P is typically done on BGA solder bump and the criteria is the flat surface area. If some wanted to apply this same technique/method to a leaded component ie. Gull wing, J lead, etc. How could one calculate the mating area/surface. They are totally different. Besides that, it is difficult to pull the leads straight up. Any thought/comments will be greatly appreciated.
Victor,
______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________