Fellow TechNetters:

   I am aware that D&P is typically done on BGA solder bump and the criteria is the flat surface area.   If some wanted to apply this same technique/method to a leaded component ie. Gull wing, J lead, etc.   How could one calculate the mating area/surface.   They are totally different.   Besides that, it is difficult to pull the leads straight up.   Any thought/comments will be greatly appreciated.

Victor,


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