big guy for being 'new'. HW?

Inge



On 26 March 2012 07:13, Jack Olson <[log in to unmask]> wrote:

> 16 YEARS at TechNet?
> I still feel like "the new guy"!!!
>
> onward thru the fog,
> Jack
>
>
> On Wed, 27 Mar 1996 07:16:59 -0800, Jack Olson <[log in to unmask]> wrote:
>
> >[log in to unmask] wrote:
> >>      Due to a "non-existent" clearance between a PWA and a shielded
> case,
> >>      we would like to have certain components with lead lengths that are
> >>      not long enough to protrude through to the secondary side of the
> >>      board.  Thus, there would be no fillet for a solder joint.
> >
> >We had a similar situation, but in our case we specified that the leads be
> >clipped (after soldering), and the fillet ground down to .030 mils. These
> >boards were for airplanes and had to undergo shock, vibration,
> environmental
> >testing etc. NO PROBLEMS. Of course, you said your clearance was
> >"non-existent", can you spare 30 mils? And by "shielded case" do you mean
> >conductive? You might have to apply some adhesive KAPTON over the pads
> after
> >you grind them, but at least by grinding you have the most lead length,
> and
> >strongest solderjoint possible, still much stronger than a SMT connection,
> >right?
> >                                                  Jack
> >p.s. I would like to hear what others recommend, though... anybody else?
> >
> >
>


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