big guy for being 'new'. HW? Inge On 26 March 2012 07:13, Jack Olson <[log in to unmask]> wrote: > 16 YEARS at TechNet? > I still feel like "the new guy"!!! > > onward thru the fog, > Jack > > > On Wed, 27 Mar 1996 07:16:59 -0800, Jack Olson <[log in to unmask]> wrote: > > >[log in to unmask] wrote: > >> Due to a "non-existent" clearance between a PWA and a shielded > case, > >> we would like to have certain components with lead lengths that are > >> not long enough to protrude through to the secondary side of the > >> board. Thus, there would be no fillet for a solder joint. > > > >We had a similar situation, but in our case we specified that the leads be > >clipped (after soldering), and the fillet ground down to .030 mils. These > >boards were for airplanes and had to undergo shock, vibration, > environmental > >testing etc. NO PROBLEMS. Of course, you said your clearance was > >"non-existent", can you spare 30 mils? And by "shielded case" do you mean > >conductive? You might have to apply some adhesive KAPTON over the pads > after > >you grind them, but at least by grinding you have the most lead length, > and > >strongest solderjoint possible, still much stronger than a SMT connection, > >right? > > Jack > >p.s. I would like to hear what others recommend, though... anybody else? > > > > > ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________