I'll echo depaneling. How close are the failed components to the panelization edge?

Blair

On Tue, 13 Dec 2011 20:35:39 -0500, Eric Laroche <[log in to unmask]> wrote:

>Hi all,
>
>We've been witnessing some field failures related to cracked
>capacitors.  We have seen it on different PCBA's, different panel
>configurations, different physical locations on boards even 3 different
>capacitor suppliers.  The only constant is that we always see it on the
>0,1uF ceramic 0603.  We've only had a couple of cross sections done as
>they are relatively expensive.  All cross sections done so far show
>evidence of board flexing causing 45degree cracks.
>
>There must be something along our process that causes this flexing.  The
>way I see it, pretty much every step can be the guilty one.  From PnP,
>reflow, repair, ICT, functional testing, depanelling and final
>mechanical assembly...up to some extent, they could all possibly be
>causing flexing and damage to capacitors.  I would like to make a more
>extensive study to isolate the source of our problems.  Are there other
>methods, less expensive than cross sectioning, to see if a capacitor is
>cracked?
>
>Have any of you faced this problem in the past?  What methods did you
>use to isolate the source of the problem?  What were your results?
>
>Thanks for your help,
>
>Eric
>

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