I'll echo depaneling. How close are the failed components to the panelization edge? Blair On Tue, 13 Dec 2011 20:35:39 -0500, Eric Laroche <[log in to unmask]> wrote: >Hi all, > >We've been witnessing some field failures related to cracked >capacitors. We have seen it on different PCBA's, different panel >configurations, different physical locations on boards even 3 different >capacitor suppliers. The only constant is that we always see it on the >0,1uF ceramic 0603. We've only had a couple of cross sections done as >they are relatively expensive. All cross sections done so far show >evidence of board flexing causing 45degree cracks. > >There must be something along our process that causes this flexing. The >way I see it, pretty much every step can be the guilty one. From PnP, >reflow, repair, ICT, functional testing, depanelling and final >mechanical assembly...up to some extent, they could all possibly be >causing flexing and damage to capacitors. I would like to make a more >extensive study to isolate the source of our problems. Are there other >methods, less expensive than cross sectioning, to see if a capacitor is >cracked? > >Have any of you faced this problem in the past? What methods did you >use to isolate the source of the problem? What were your results? > >Thanks for your help, > >Eric > --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 16.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives For additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------