Hello Technetters.

We use a ceramic substrate covered with Cu layer. This Cu layer is plated 
with ENIG process. 
We solder SMD's on it with SnPb process (vapor phase and iron).
The ASTM specifications give a thickness of Ni 4 ± 2 µm.
Where comes from this value ?
What could be an issue with thinner Ni layer like 0.5 µm ?
Thanks to answer.

Best regards,

CANTAGALLO Luigi

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