All the tests should be done after drying simulation (as in EMS production
floor) and after reflow profile process.

Reuven

On Thu, Aug 4, 2011 at 6:29 PM, Gerry Gagnon <[log in to unmask]>wrote:

>
>
> Hi Richard,
>
>
>
> The only things that come to mind:
>
>
>
> Run wetting balance tests along with your traditional dip and look tests.
> Sometimes these curves point out "interesting" things before they happen to
> you in assembly.
>
>
>
> After simulating your soldering processes in your message below, choose a
> mechanical shock test to see how well you formed that nickel-tin
> intermetallic bond!
>
>
>
> Regarding XRF, make sure you have a good unit, follow IPC procedure, and
> make sure your calibration standard set matches the ENIG deposit you are
> measuring.
>
>
>
> Best of luck
>
> Gerry
>
>
>
>
>
> ----------------------------------------
> > Date: Wed, 3 Aug 2011 13:26:32 -0500
> > From: [log in to unmask]
> > Subject: Re: [TN] Steps to take to prevent ENIG issues
> > To: [log in to unmask]
> >
> > Boy, I cannot tell all of you how much I appreciate all of your
> responses.
> >
> > Now for the tougher part of the question:
> > What methods can be used to DETECT the ENIG plating issues in-house,
> before the PWB ever gets to the manufacturing floor? Some things I can think
> of are:
> >
> > Use EDS/XrF testing per Appendix 4 of IPC 4552 to determine the thickness
> of ENIG. This would help indicate that there may be issues
> >
> > Use a solder test coupon of a particular design (board from Hell) with
> SMT parts on both sides plus subsequent through-hole parts to be
> hand-soldered and a single component to be hot-gas reworked to simulate the
> conditions that the production boards will go through, such that if one or
> two coupons are quickly assembled, reworked, and hand soldered with a couple
> of bakes thrown in, and no issues are seen, one can reasonably assume the
> rest of the production lot will also be good.
> >
> > Use a coupon and run it through two reflow profiles, a selective solder
> pass, and then solder only a handful of PTH and SMT components, and then
> subject it to 15 thermal cycles of say -40 to +125 C to test for issues
> before releasing the lot of PWBs. This would detect the failures of delayed
> P-rich level, which typically show up later after soldering and test are
> complete.
> >
> > Any other ideas? Tell me your thoughts. Yes, I know some cost is
> involved, but I need to know what tests would provide the best cost versus
> assurance.
> >
> > For those of us who either must use or prefer to use ENIG, but want to
> prevent any issues from showing up, well, we all benefit here.
> >
> >
> > From: Reuven Rokah [mailto:[log in to unmask]]
> > Sent: Wednesday, August 03, 2011 12:17 PM
> > To: TechNet E-Mail Forum; Stadem, Richard D.
> > Subject: Re: [TN] Steps to take to prevent ENIG issues
> >
> > Choose a reliable source and not jump from source to source searching for
> better prices only...
> >
> > Reuven
> >
> >
> > On Wed, Aug 3, 2011 at 6:16 PM, Stadem, Richard D. <[log in to unmask]
> <mailto:[log in to unmask]>> wrote:
> > I have a client who is switching PWB fabricators for ENIG finishes. They
> are fully aware of ENIG issues such as Black Pad, Brittle Nickel, etc., and
> want to know whatever steps can be taken to prevent ENIG PWBs from reaching
> production with these issues.
> > Does anyone have any suggestions?
> >
> >
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> > --
> > Best Regards,
> >
> > Reuven Rokah
> >
> > Mobile: 972-52-60-120-18
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-- 

Best Regards,

*Reuven Rokah*

Mobile: 972-52-60-120-18
Tele-fax: 97239360688
<http://www.rokah-technologies.com/>[log in to unmask]
[log in to unmask]
www.rokah-technologies.com

**


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