All the tests should be done after drying simulation (as in EMS production floor) and after reflow profile process. Reuven On Thu, Aug 4, 2011 at 6:29 PM, Gerry Gagnon <[log in to unmask]>wrote: > > > Hi Richard, > > > > The only things that come to mind: > > > > Run wetting balance tests along with your traditional dip and look tests. > Sometimes these curves point out "interesting" things before they happen to > you in assembly. > > > > After simulating your soldering processes in your message below, choose a > mechanical shock test to see how well you formed that nickel-tin > intermetallic bond! > > > > Regarding XRF, make sure you have a good unit, follow IPC procedure, and > make sure your calibration standard set matches the ENIG deposit you are > measuring. > > > > Best of luck > > Gerry > > > > > > ---------------------------------------- > > Date: Wed, 3 Aug 2011 13:26:32 -0500 > > From: [log in to unmask] > > Subject: Re: [TN] Steps to take to prevent ENIG issues > > To: [log in to unmask] > > > > Boy, I cannot tell all of you how much I appreciate all of your > responses. > > > > Now for the tougher part of the question: > > What methods can be used to DETECT the ENIG plating issues in-house, > before the PWB ever gets to the manufacturing floor? Some things I can think > of are: > > > > Use EDS/XrF testing per Appendix 4 of IPC 4552 to determine the thickness > of ENIG. This would help indicate that there may be issues > > > > Use a solder test coupon of a particular design (board from Hell) with > SMT parts on both sides plus subsequent through-hole parts to be > hand-soldered and a single component to be hot-gas reworked to simulate the > conditions that the production boards will go through, such that if one or > two coupons are quickly assembled, reworked, and hand soldered with a couple > of bakes thrown in, and no issues are seen, one can reasonably assume the > rest of the production lot will also be good. > > > > Use a coupon and run it through two reflow profiles, a selective solder > pass, and then solder only a handful of PTH and SMT components, and then > subject it to 15 thermal cycles of say -40 to +125 C to test for issues > before releasing the lot of PWBs. This would detect the failures of delayed > P-rich level, which typically show up later after soldering and test are > complete. > > > > Any other ideas? Tell me your thoughts. Yes, I know some cost is > involved, but I need to know what tests would provide the best cost versus > assurance. > > > > For those of us who either must use or prefer to use ENIG, but want to > prevent any issues from showing up, well, we all benefit here. > > > > > > From: Reuven Rokah [mailto:[log in to unmask]] > > Sent: Wednesday, August 03, 2011 12:17 PM > > To: TechNet E-Mail Forum; Stadem, Richard D. > > Subject: Re: [TN] Steps to take to prevent ENIG issues > > > > Choose a reliable source and not jump from source to source searching for > better prices only... > > > > Reuven > > > > > > On Wed, Aug 3, 2011 at 6:16 PM, Stadem, Richard D. <[log in to unmask] > <mailto:[log in to unmask]>> wrote: > > I have a client who is switching PWB fabricators for ENIG finishes. They > are fully aware of ENIG issues such as Black Pad, Brittle Nickel, etc., and > want to know whatever steps can be taken to prevent ENIG PWBs from reaching > production with these issues. > > Does anyone have any suggestions? > > > > > > ______________________________________________________________________ > > This email has been scanned by the MessageLabs Email Security System. > > For more information please contact helpdesk at x2960 or > [log in to unmask]<mailto:[log in to unmask]> > > ______________________________________________________________________ > > > > --------------------------------------------------- > > Technet Mail List provided as a service by IPC using LISTSERV 16.0 > > To unsubscribe, send a message to [log in to unmask]<mailto: > [log in to unmask]> with following text in > > the BODY (NOT the subject field): SIGNOFF Technet > > To temporarily halt or (re-start) delivery of Technet send e-mail to > [log in to unmask]<mailto:[log in to unmask]>: SET Technet NOMAIL or (MAIL) > > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]<mailto:[log in to unmask]>: SET Technet Digest > > Search the archives of previous posts at: > http://listserv.ipc.org/archives > > For additional information, or contact Keach Sasamori at [log in to unmask] > <mailto:[log in to unmask]> or 847-615-7100 ext.2815<tel:847-615-7100 > %20ext.2815> > > ----------------------------------------------------- > > > > > > > > -- > > Best Regards, > > > > Reuven Rokah > > > > Mobile: 972-52-60-120-18 > > Tele-fax: 97239360688 > > <http://www.rokah-technologies.com/>[log in to unmask] > > <mailto:[log in to unmask]>[log in to unmask]<mailto: > [log in to unmask]> > > www.rokah-technologies.com<http://www.rokah-technologies.com/> > > > > [http://royiro.weebly.com/uploads/6/3/6/9/6369812/4511319.jpg?303] > > > > > > > > ______________________________________________________________________ > > This email has been scanned by the MessageLabs Email Security System. > > For more information please contact helpdesk at x2960 or > [log in to unmask] > > ______________________________________________________________________ > > > > --------------------------------------------------- > > Technet Mail List provided as a service by IPC using LISTSERV 16.0 > > To unsubscribe, send a message to [log in to unmask] with following text > in > > the BODY (NOT the subject field): SIGNOFF Technet > > To temporarily halt or (re-start) delivery of Technet send e-mail to > [log in to unmask]: SET Technet NOMAIL or (MAIL) > > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > > Search the archives of previous posts at: > http://listserv.ipc.org/archives > > For additional information, or contact Keach Sasamori at [log in to unmask] 847-615-7100 > ext.2815 > > ----------------------------------------------------- > > ______________________________________________________________________ > This email has been scanned by the MessageLabs Email Security System. > For more information please contact helpdesk at x2960 or [log in to unmask] > ______________________________________________________________________ > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 16.0 > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to > [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > For additional information, or contact Keach Sasamori at [log in to unmask] or > 847-615-7100 ext.2815 > ----------------------------------------------------- > -- Best Regards, *Reuven Rokah* Mobile: 972-52-60-120-18 Tele-fax: 97239360688 <http://www.rokah-technologies.com/>[log in to unmask] [log in to unmask] www.rokah-technologies.com ** ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. 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